MT-13®

 MT-13®

Smooth-On MT-13®为高性能环氧树脂粘合剂,适用于需要最大抓力和防水性的应用场合。MT-13®是双组分环氧粘合剂,按等量体积混合(100A / 123B重量比),操作时间35分钟,在73°F /23°C下16小时内达到强度。MT-13 ®非常适合多孔和无孔表面粘合。MT- 13®广泛用于船舶工业的组装和一般维修。MT- 13®在极端寒冷的条件下仍可保持抓力。

特征

说明

Safety - Use in a properly ventilated area (“room size” ventilation). Wear safety glasses, long sleeves and rubber gloves to minimize contamination risk.
 

Store and use material at room temperature (73°F/23°C). This product has a limited shelf life and should be used as soon as possible.

A clean, dry surface is a necessary prerequisite for adhesive bonding. Adhesives will stick to either the surface of which a bond is desired or to that film of extraneous material directly on that surface. Rarely can a structural adhesive penetrate through surface contaminants to provide an optimum bond on an unclean surface.

Porous materials are simple to bond, provided they are dry. The surface should be sanded till clean and free from dust. Nonporous surfaces, such as found on metal and plastic materials, should be degreased, dried and roughened by sanding, sandblasting or chemical etching. The etched or sandblasted surfaces should be covered within a few hours of treatment to prevent contamination.

Epoxy adhesives do not perform well on metals such as nickel, chromium, tin or zinc nor on soft thermoplastics like polyethylene. Refer to the Preparation of Surfaces for Adhesive Bonding technical bulletin.

Because no two applications are quite the same, a small test application to determine suitability for your project is recommended if performance of this material is in question.


MIXING AND APPLYING...

Measure equal amounts of Parts A and B (or 100A:123B by weight) and mix thoroughly for 3 minutes to a uniform color (no streaks). Apply to prepared surface at a thickness of 1/32” - 1/16” (0.08cm - 0.16cm). Fit other surface over epoxy and apply even pressure using clamps or weights until material cures.


CURING...
MT-13® will cure and reach handling strength in 16 hours at room temp. (73°F/23°C). Applying uniform mild heat will cure epoxy faster–150°F/65°C for 4 hours. Let cool to room temperature before moving bonded substrates.

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